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MIRTEC TO PREMIER ITS TECHNOLOGICALLY ADVANCED AUTOMATED OPTICAL INSPECTION EQUIPMENT AT SMTAI Orlando 2012

Industry News | 2012-09-13 10:44:36.0

MIRTEC, “The Global Leader in Inspection Technology”, announced that it will premier its Technologically Advanced AOI Equipment at SMTAI Orlando 2012

MIRTEC Corp

MIRTEC to Exhibit Its Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2016

Industry News | 2016-08-29 18:31:30.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its award-winning 3D AOI and 3D SPI systems in Booth #707 at the 2016 SMTA International Exhibition. The exhibition will take place September 27-28, 2016 at the Donald Stephens Convention Center located in Rosemont, IL.

MIRTEC Corp

MIRTEC to Exhibit Their Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2017

Industry News | 2017-08-14 19:06:07.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier their award-winning 3D AOI and 3D SPI systems in Booth #606 at the 2017 SMTA International Exhibition. The exhibition will take place September 19-20, 2017 at the Donald Stephens Convention Center located in Rosemont, IL.

MIRTEC Corp

Best Rated Cost, Flexibility & Technology – MIRTEC’s MV-6 OMNI 3D AOI System at productronica

Industry News | 2017-10-17 19:32:15.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System in Hall A2, Booth 329 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Additionally, the company will show the MS-11e 3D SPI, MV-3 OMNI Desktop 3D AOI and INTELLISYS® software.

MIRTEC Corp

Center for Electronics Manufacturing and Assembly Receives Automated Optical Inspection Equipment

Industry News | 2020-04-11 14:25:00.0

Increased capabilities in lab will support increased research and training opportunities in photonic

MIRTEC Corp

MIRTEC to Unveil Revolutionary Inspection Technologies for Perfect Solder Joints and 30% Productivity Boost at productronica

Industry News | 2023-11-13 12:28:17.0

MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2020

Industry News | 2020-01-06 16:06:59.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.

MIRTEC Corp

Counterfeit Component Prevention Training Course

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Frost & Sullivan Recognizes MIRTEC as 2013 Company of the Year for SMT Automated Optical Inspection

Industry News | 2013-11-21 18:07:17.0

The company has demonstrated an unrivaled ability to understand the complexity of electronics assembly as well as key customer needs

MIRTEC Corp


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