Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef
Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service
Electronics Forum | Mon Feb 23 23:50:18 EST 1998 | mike
| Does anyone have any experience with via in pad for | BGAs using conventional thru hole technology? | Steve Joy Steve, I had a customer who had designed a board to use a BGA socket. Well the socket did not work out so we then placed the bga dire
Electronics Forum | Wed Mar 10 15:09:34 EST 2004 | Jay
You can say "re-flow". It's related with the process. In order to assemble a PC Board containing lots of components such as PTH (Plated Through Hole) and SMT, usually, PTH type packages and components are soldered first using wave soldering process.
Electronics Forum | Sun Mar 28 18:49:36 EDT 2021 | mekmat544
Hello, I would like to ask you if there is some formula how to calculate PTH hole and annual ring for pin in paste technology? Thank you. Mekmat.
Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
Electronics Forum | Mon Apr 01 07:41:40 EST 2002 | davef
Hey Bob, Boy, you are lucky to have a laboratory, and now colorful pix!!! The only silver IMC that you will see are: * Ag6Sn, much less likely at 'normal' soldering temperatures * Ag3Sn, much more likely Allowable silver concentration: * Below 2%
Electronics Forum | Mon Feb 06 09:17:35 EST 2006 | Cal Kolokoy
Mike did you have these SEM'd to be able to see the IMC's within the solder joint?
