Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman
Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Thu Jun 22 07:15:37 EDT 2006 | amol_kane
do you mean microvoids or macrovoids??
Electronics Forum | Tue Jun 27 12:12:05 EDT 2006 | GMan
Yes it does seem like a plating issue and analysis is being done. Thank you for your inputs.
Electronics Forum | Wed Jun 28 02:29:48 EDT 2006 | Loco
Wow, great article there mike! Thanks for digging it up for us! Kind regards, Loco.
Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef
It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.
Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman
Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Tue Jun 27 16:29:28 EDT 2006 | Board House
There was a good artical on this in Assembly Magazine October 5, 2005 by Donald P. Cullen, Director of OEM and Assembly Applications, MacDermid Inc., Waterbury, CT Heres the Link http://www.assemblymag.com/CDA/Archives/56840a86f06c9010VgnVCM10000
