Electronics Forum | Thu Jun 22 07:15:37 EDT 2006 | amol_kane
do you mean microvoids or macrovoids??
Electronics Forum | Tue Jun 27 12:12:05 EDT 2006 | GMan
Yes it does seem like a plating issue and analysis is being done. Thank you for your inputs.
Electronics Forum | Wed Jun 28 02:29:48 EDT 2006 | Loco
Wow, great article there mike! Thanks for digging it up for us! Kind regards, Loco.
Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef
It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.
Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman
Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Tue Jun 27 16:29:28 EDT 2006 | Board House
There was a good artical on this in Assembly Magazine October 5, 2005 by Donald P. Cullen, Director of OEM and Assembly Applications, MacDermid Inc., Waterbury, CT Heres the Link http://www.assemblymag.com/CDA/Archives/56840a86f06c9010VgnVCM10000
Electronics Forum | Wed Jun 28 22:34:31 EDT 2006 | davef
Yes, it would. That you are asking this question makes us wonder if you would be better advised to contract with a independent FA laboratory to help you baseline your analysis. Among the fine labs to consider are: * Robisan Laboratory 6502 East 21
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