Full Site - : immersion depth (Page 2 of 8)

Aqueous Technologies to Exhibit StencilWasher-ECO at APEX 2009

Industry News | 2009-03-23 13:25:37.0

Rancho Cucamonga, CA - March 2009 � Aqueous Technologies Corp. announces that it will exhibit the StencilWasher-ECO semi-automatic stencil cleaner for solder paste removal in booth 2247 at the upcoming IPC/APEX exhibition and conference scheduled to take place March 31-April 2, 2009 in Las Vegas.

Aqueous Technologies Corporation

Libra Industries Upgrades the Speed on Its ACE K.I.S.S. Selective Solder System

Industry News | 2017-02-20 16:25:11.0

Libra Industries is pleased to announce that it has upgraded the software on its ACE K.I.S.S. 102 selective solder machine. With the new software and drive system, Libra Industries’ ACE K.I.S.S. 102 runs up to 30 percent faster and the programming time has been reduced by at least 50 percent. Additionally, the new software has a better user interface along with dual screens to watch the product run and detect issues early on.

Libra Industries, Inc.

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

Microtronic GmbH Presents the Future in Solderability Test: Dip and Look Automator

Industry News | 2021-06-30 04:24:18.0

Microtronic GmbH is pleased to introduce the new Automated & PC-Controlled D&L Automator for Dip and Look. Designed and manufactured in Germany, the new system meets IPC-J-STD-002 and 003 Standards.

Microtronic GmbH

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

New Equipment | Fabrication Services

RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban

Advanced Circuitry International

Qualitek Electronics (M) Sdn Bhd

New Equipment |  

Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa

Qualitek Electronics (M) Sdn Bhd

Attend the IEW – for Stimulating Discussions on ESD with Colleagues from Around the World!

Industry News | 2017-01-25 10:06:49.0

Register today for the 11th Annual International Electrostatic Workshop (IEW) being held May 7-11, 2017 at the Granlibakken Conference Center & Lodge, Lake Tahoe, CA USA The IEW facilitates access to and interactions with industry leaders through invited seminars, technical sessions, special interest groups (SIGs), discussion groups (DGs), and invited speakers. This year we focus on The Intersection of ESD Challenges for Emerging/Advancing Technologies and Markets; IC Designer’s Perspective on ESD; and Everything EOS – Product, Failure Analysis, Reliability, Verification, and Test Engineers. Participating at the IEW will provide: • An immersive, interactive experience with experts on technical advancements • All-inclusive pricing – workshop, hotel, and meals • Peer reviewed poster format for future full paper development • Gain valuable industry recognition and receive feedback • Interactive and in-depth discussion groups

EOS/ESD Association, Inc.


immersion depth searches for Companies, Equipment, Machines, Suppliers & Information

Sell Your Used SMT & Test Equipment

Best Reflow Oven
Formic Reflow Soldering

Stencil Printing 101 Training Course
PCB Handling Machine with CE

Software for SMT placement & AOI - Free Download.
IPC Training & Certification - Blackfox

World's Best Reflow Oven Customizable for Unique Applications