Electronics Forum | Mon Feb 19 12:25:18 EST 2001 | Donnie D.
One other thing you may want to look at is your nitrgen settings and the difussers. If you don't have them correct, you can also see bridging and icicles.
Electronics Forum | Mon Dec 23 17:20:05 EST 2002 | davef
Try: * Prebake * Flux density * Conveyor speed * Upper preheat * Cooling time * Chip wave * Solder temperature You could add immersion depth (1/3 to 2/3 of the board) to convince yourself that it has the least impact of any variable in wave solderin
Electronics Forum | Wed Jun 11 09:16:05 EDT 2003 | davef
Il ne pas de quois. Two most important parameters are: * Solder temperature * Dwell time Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering.
Electronics Forum | Wed Mar 01 09:56:15 EST 2006 | russ
I would definitely try a more agressive flux. Are you using a W.S. or No-Clean? And of course check the usual preheat temp flux application dwell time immersion depth
Electronics Forum | Thu Nov 08 13:12:02 EST 2007 | russ
Annular rings are too big, it is acceptable to have shorts on the common conductors. I would be willing to say the "other" supplier may have modified the artwork as well. Good fluxing, preheat and proper immersion depth are key to eliminating short
Electronics Forum | Tue Feb 19 16:19:26 EST 2008 | edatasys
Check out http://www.solderstar.co.uk/wavePro.html This tool measures all key wave solder information with a single pass. Wave/PCB contact, immersion depths, etc. Also has a reflow pack to allow use on reflow, 9 channels with predictive software. B
Electronics Forum | Thu Jul 17 14:30:42 EDT 2008 | tommyg_fla
1500 lbs) vary by a couple of degrees) were standard. I thought that flux penetration into PTH barrel and solder pot immersion depth and solder pot parallelism would be also critical factors. We are using the ECD WaveRider to measure the implied sold
Electronics Forum | Tue Dec 21 19:48:27 EST 1999 | Russ
John, we have waved 0603 packages for a long time, We have also started on 0402. Are you concerned with shorting across the component body or to other components? You should have no problems with these parts in a wave process. A couple of things
Electronics Forum | Wed Oct 23 14:45:00 EDT 2002 | Tom G
I haven't tried anything like that but had some experience with .8 mm pitch SSOPs. Immersion depth in wave was very critical- had to control Lambda pump speeds within 20 RPM and even then it would change as solder level dropped. Need thieving pads o
Electronics Forum | Wed Feb 12 16:23:30 EST 2003 | russ
I agree with DDave, You have something else wrong! .100 dips with .05" lead protrusion should not bridge (in fact I would think that it would be almost impossible). Tell us about your machine, (laminar flow, A-wave, etc.., size of nozzle, wave heig
