Electronics Forum | Fri Aug 11 14:29:58 EDT 2017 | abruno1995
I am having issues with this. I am having excess plating on my pcb board and i want to know if this is a ICP Class 1-3 Issue. 1. Excess Plating 2. Dark Vias Thank you
Electronics Forum | Fri Apr 09 20:28:14 EDT 2004 | Ken
I have experience in this. My company offers Lead free SMT and Wave soldering. I have processed ImSn, ImAg, Enig, OSP in both smt and wave. Yes, silver leaching will occur. Yes, copper leaching will occur. High tin content solders disolve everyt
Electronics Forum | Tue Apr 13 07:48:00 EDT 2004 | Dougie
Hi Ken, Our product is consumer, although our product is sold on it's reliability. We run a low volume high mix throughput. Any ideas on timescale for the Ag leaching? Sounds like it could be a safer bet to use Imm Sn boards with the Sn/Cu/Ni bar w
Electronics Forum | Tue Apr 19 11:54:36 EDT 2005 | masters
The email address was stripped from this post, a user complained about receiving a virus or some malicious code from the suspected address. Knowingly sending viral code is against the law. Posting personal information to circumvent SMTNet is again
Electronics Forum | Thu Aug 31 02:10:42 EDT 2017 | hxamalia
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Electronics Forum | Wed Apr 07 09:23:20 EDT 2004 | davef
In addition to your concerns about leaching, why aren't you concerned about: * Tin whiskers * Total absence of in use reliability information about no-lead, especially given that creep is significantly different between SnPb and no-leads. While they
Electronics Forum | Thu Apr 08 04:52:24 EDT 2004 | Dougie
We are concerned about the issues you mentioned and more, however we have no option but to change over due to legislation. A high percentage of our market share is in Europe and Japan, who of course have already embraced the no-lead change. We simply
Electronics Forum | Fri Aug 11 22:14:59 EDT 2017 | dawson
Hi Adonys, What's ICP 1-3? Do you mean IPC? 1. Excess Plating- no excess, but filled with something which generated in the process of copper plating. 2. Dark Vias - it's oxidized. and the solder mask printing is not aligned. The board is failed. M
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
