Full Site - : immersion silver pad adhesion (Page 6 of 15)

imm. silver

Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef

Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in

battery pad

Electronics Forum | Wed Feb 28 14:25:33 EST 2007 | Bill

We have a board that uses a solder pad for one of the contacts of a button battery and had no problems when we were washing the boards. We are now using a no-clean flux and find that on a bunch of boards there is a coating of flux covering the pad s

Black pad defect

Electronics Forum | Mon Mar 17 18:11:32 EST 2003 | davef

Converting to immersion silver is the best solution to the "black pad problem".

Black pad defect

Electronics Forum | Wed Apr 02 23:21:24 EST 2003 | scottf

Make the move to Silver Immersion, no nickel to mess with!

PCB Type

Electronics Forum | Wed Jun 21 08:55:39 EDT 2006 | yme111

Hi, Thanks for this reply. Our problem is that our customer complained that the pcb that we sent them is not Immersion silver though the actual appearance of the pad is silver. They claim that it is only silver and not Immersion silver. We asked our

De-wetting on Immersion Silver finish board

Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa

One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify

Immersion Silver - Sulphur

Electronics Forum | Fri Feb 21 20:41:32 EST 2003 | Raul

It is a common knowledge that sulphur and immersion silver finish on a PCB do not go together very well. We are seeing peaks of sulphur on some of our assemblies (with silver finish) and as expected we experience severe difficulties with processing t

Black PAD

Electronics Forum | Fri Jun 16 07:46:42 EDT 2006 | davef

We use HASL and immersion silver, depending on the board design.

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon

| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest

electrically conductive adhesives

Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob

Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W


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