Electronics Forum | Tue Mar 20 20:12:32 EST 2001 | davef
In response to a similar question Dennis Fritz [DDFRITZ@AOL.COM] Chair of the Alternate Final Finishes Committee of IPC (5-23d) said ... The Alternate Final Finishes Committee of IPC (5-23d) has nearly completed a round robin "conditioning" study of
Electronics Forum | Mon Apr 26 16:14:08 EDT 1999 | John W
| Hi Murray! | | Justin pretty much summed things up...covered all the points. So I'm just gonna give you my preference of what I like other than HASL finish. | | Electroless Nickle/Immersion Gold...nice flat pads...hmmmmmmm, Steve likes flat pads.
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
