SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Industry News | 2008-06-06 19:09:39.0
NASHVILLE � June 4, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will showcase METALNOX M6440 aqueous immersion cleaner and brightener in booth 633 at the 2008 Orthopaedic Manufacturing & Technology (Omtec) exposition and conference scheduled to take place June 18-19, 2008 at the Donald E. Stephens Convention Center in Rosemont, IL.
Industry News | 2008-05-30 14:53:00.0
NASHVILLE � May 30, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will display AQUANOX A4625 Aqueous Cleaner for Lead-Free Flux Residues and METALNOX M6440 aqueous immersion cleaner and brightener in booth 3030 at the Medical Design & Manufacturing (MD&M) East 2008 exhibition and conference, scheduled to take place June 3-5, 2008 at the Jacob K. Javits Convention Center in New York.
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
Industry News | 2009-05-18 17:19:51.0
GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
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