4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Industry News | 2008-06-06 19:09:39.0
NASHVILLE � June 4, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will showcase METALNOX M6440 aqueous immersion cleaner and brightener in booth 633 at the 2008 Orthopaedic Manufacturing & Technology (Omtec) exposition and conference scheduled to take place June 18-19, 2008 at the Donald E. Stephens Convention Center in Rosemont, IL.
Industry News | 2008-05-30 14:53:00.0
NASHVILLE � May 30, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will display AQUANOX A4625 Aqueous Cleaner for Lead-Free Flux Residues and METALNOX M6440 aqueous immersion cleaner and brightener in booth 3030 at the Medical Design & Manufacturing (MD&M) East 2008 exhibition and conference, scheduled to take place June 3-5, 2008 at the Jacob K. Javits Convention Center in New York.
Industry News | 2009-05-18 17:19:51.0
GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
New Equipment | Cleaning Agents
Aqueous Cleaner for Flip Chips and Advanced Packaging AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and environmental sa
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
Industry News | 2021-03-03 14:17:42.0
New CIT Relay & Switch IP67 Process Sealed VM3S Series Snap-Action Switch Protects Against Environmental Distress
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
