Industry News | 2021-03-03 14:17:42.0
New CIT Relay & Switch IP67 Process Sealed VM3S Series Snap-Action Switch Protects Against Environmental Distress
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Industry News | 2013-05-07 13:45:19.0
AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.
Industry News | 2009-11-02 21:59:00.0
GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2013-05-13 15:06:06.0
AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.
Industry News | 2008-10-08 14:54:25.0
NASHVILLE � October 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will showcase AQUANOX A4625 and METALNOX M6440 in booth 634 at the upcoming Medical Design & Manufacturing (MD&M) Minneapolis exhibition and conference scheduled to take place October 22-23, 2008 at the Minneapolis Convention Center in Minneapolis, MN.
Industry News | 2013-03-18 17:06:13.0
AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2013-04-01 09:02:49.0
AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA
Industry News | 2013-04-08 19:29:43.0
AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
