Electronics Forum | Wed Apr 13 07:10:17 EDT 2005 | masters
In addition,how to deal with the misprint immersion Ag PCB?Now,we just remove the paste,clean it,and exposed in air for 2 hours,and then put to use.
Electronics Forum | Mon Apr 18 20:44:30 EDT 2005 | davef
Charly: Why do you "need to bake the PCb due to moisture issue", if you're not going to use the board? Why bake the board, just to put it back in storage, absorb moisture, and require baking again?
Electronics Forum | Wed Apr 20 01:08:16 EDT 2005 | charly
actually, i received a shipment from supplier where the vacuum seal was puntual and the HIC is out of order, the supplier ask me to bake and keep back into the store, but i worry is there any quality impact if i do so?
Electronics Forum | Tue Apr 19 11:54:36 EDT 2005 | masters
The email address was stripped from this post, a user complained about receiving a virus or some malicious code from the suspected address. Knowingly sending viral code is against the law. Posting personal information to circumvent SMTNet is again
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Wed Jul 29 13:44:45 EDT 1998 | David Spilker
We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone had
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Sat Nov 12 12:11:22 EST 2022 | micropak
Thank you Stephen... I also mistaken it with Immersion Silver.
