Electronics Forum | Tue May 02 14:27:43 EDT 2006 | bhall
In the past we have used immersion tin as an alternative for HASL. Our biggest problem was shelf life. The tin oxidized very rapidly. We switched to immersion gold and have had great success.
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef
We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon
| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t
Electronics Forum | Wed Mar 11 11:05:06 EST 1998 | Earl Moon
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter
| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m
Electronics Forum | Thu Dec 12 09:35:45 EST 2002 | Randy Villeneuve
We are using Immersion tin in production. We specify Omikron-plus tin which according to the information is much better in solderability and shelf life than standard immersion tin. I am not having any problems with the finish and we are running it th
Electronics Forum | Tue Jun 02 17:45:46 EDT 2009 | boardhouse
Hi Nicoleta, As a board shop, either are good choices but in my experience with my customers ENIG has alway been the favorite due to it is easier to work with in regards to not having to tweak your equipment. As long as the board shop that you are u
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