Electronics Forum | Sun Jun 01 13:50:12 EDT 2014 | sync40
Thank you for your reply davef. Although the US restriction, I think that there are plenty of users of immersion tin in Americas, mainly low-volume fabs that do not plan to outsource finishing, or do not plan or can not invest in a HASL. If we res
Electronics Forum | Mon Jun 02 15:09:10 EDT 2014 | davef
I've never heard of anyone affected by thiourea during assembly soldering operations. I believe the greatest concern of exposure to thiourea is during the board fabrication process. BR ... davef
Electronics Forum | Mon Jun 02 20:38:42 EDT 2014 | davef
I believe that you get better responses when you start a new thread, but that's just an opinion, not a rule. BR ... davef
Electronics Forum | Mon Jun 02 15:51:17 EDT 2014 | sync40
Thank you so much again davef for your new reply. This past weekend I was looking for more information regarding this subject, but, as you stated there is no information about thioruea concerns during assembly soldering operations, mainly focused in
Electronics Forum | Wed Jul 29 22:50:17 EDT 1998 | Dave F
| We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone ha
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef
Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Mon Nov 25 16:12:52 EST 2002 | russ
there is a good article by AIM solder regarding tin. In a nut shell, if you do not apply flux or heat to tin finish you will never degrade it! I agree with the others that you need to check the thickness of the pure tin layer. We have forbidden ti
Electronics Forum | Thu Dec 21 20:09:01 EST 2000 | Dave F
You are one lucky person to have access to the fine SMTnet Archives. They have over a hundred threads on immersion tin, white tin, and the other variants.
