Electronics Forum | Fri Mar 18 15:39:18 EDT 2011 | bk
Tyco had a good read on the shelf life of tin plating and the different variables involved in determining it's shelf life. http://www.tycoelectronics.com/documentation/whitepapers/pdf/Keeping_Tin_Solderable.pdf
Electronics Forum | Tue Aug 09 11:57:11 EDT 2005 | Board House
Hi Ted, I am a Sales Manager for a Circuit board Manufacture in MN. We have seen the Majority of our Customer base switch to Enig do to shelf life issues of silver and Tin. Silver, Tin & OSP all have a shelf life between 6 - 8 Mos. Enig is betwee
Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz
Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l
Electronics Forum | Wed Jul 07 11:49:34 EDT 2004 | Svensen
Curiously... Shelf-life of the plating alternatives has been mentioned several times as a potential issue in these discussions. Tell me is there a market for a simple plastic packaging which could extend shelf life (and hence solderability) of these
Electronics Forum | Mon Nov 19 20:15:39 EST 2001 | davef
Now, that is one thickass board!!! The rant first: If our �board supplier changed our board surface finish on� anything without our approval, the board supplier would be an �X�. Life has enough surprises. And of all the flat finishes available, h
Electronics Forum | Thu Sep 02 10:24:35 EDT 2004 | dj_jago
Greetings from the UK: I have been quite fortunate to lead (no pun intended) our company towards lead free sooner rater than later. One of our customers produces a product which is refurbushed every 6 months or so and sent back into the market. A
Electronics Forum | Mon May 13 11:17:57 EDT 2002 | genny
I think for our company, the reason we have not yet tried it is two fold. One - we are just barely starting to see a need on a new product under design for a flat finish, so currently we don't use any of the really flat finishes available. Two - Silv
Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon
| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
Electronics Forum | Fri Jun 18 12:20:16 EDT 1999 | John Thorup
| Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave review
