Full Site - : immersion tin shelf life (Page 10 of 16)

Tin Lead Electrodeposited Plating and Conformal Coat

Electronics Forum | Wed Nov 20 16:47:10 EST 2013 | aaronpavone

I have a right angle male shrouded connector and the whole set of termination leads is tin lead plated, at least 100 microinches thick. Should the entirety of the lead be conformal coated? Or can we have just the joint coated? I know I have coated le

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon

| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those

Re: Component Shelf Life

Electronics Forum | Thu Aug 29 07:21:28 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont

Re: HASL - again?

Electronics Forum | Mon Jun 21 09:58:25 EDT 1999 | Christopher Cross

| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi

Why gold plating on PCB?

Electronics Forum | Fri Feb 28 01:36:43 EST 2020 | crystal12

&gt; What is the use of gold plated boards? <BR> <BR> With the increasing integration of IC, the more IC the more dense. The vertical tin spray process is difficult to flatten the pads, which brings difficulty to the SMT mounting, and

Sn/Pb diffusion

Electronics Forum | Wed May 15 10:55:35 EDT 2002 | geoff_goring

As I thought..... This is probably why most journals and standards I have studied hold shy of even attempting to predict shelf life. They certainly hold off of any predictions when based on accelerated life testing too. The component lead is a cop

BGA non wetting

Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70

Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr

Criteria for Min Thickness regarding Large and Small pads

Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef

It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu

looking for HASL TIN thickness specification

Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster

At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera

Long term effect of lead free solder on plating

Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef

Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass


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