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Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Ease of Application for Infiniband I/O Connectors

Industry News | 2003-04-22 09:33:13.0

Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.

SMTnet

Upgraded CAM Software Eliminates More Bugs

Industry News | 2003-03-12 08:28:44.0

CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Using the LCR meter (Keysight E4980AL) 777 visualizaciones25 ago 2021

Using the LCR meter (Keysight E4980AL) 777 visualizaciones25 ago 2021

Videos

Option 032 version: 20 Hz to 300 kHz 0.05% basic accuracy with superior measurement repeatability at low and high impedance 16 impedance parameters 4-digit resolution in any range High-resolution 7-digit LCD display 100 µ Vrms, 1 µA

SMTUNION

How to Control Impedance

Industry News | 2018-10-18 10:52:03.0

How to Control Impedance

Flason Electronic Co.,limited

Basics of Control Impedance

Industry News | 2018-10-18 11:16:22.0

Basics of Control Impedance

Flason Electronic Co.,limited

What are PCB Thickness Options?

Industry News | 2018-10-18 11:08:57.0

What are PCB Thickness Options?

Flason Electronic Co.,limited

Issues Impeding U.S. Electronics Manufacturers’ Competitiveness Given Platform for Change at IPC Summit and Capitol Hill Day

Industry News | 2011-05-27 23:00:33.0

Government over-regulation, export controls and maintaining the military and aerospace sectors’ use of U.S. electronic interconnect manufacturing capacity are just some of the key issues that will be addressed at the IPC Summit on American Competitiveness and Capitol Hill Day, June 15-16, 2011, in Washington, D.C.

Association Connecting Electronics Industries (IPC)


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