Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Electronics Forum | Mon Aug 27 08:08:20 EDT 2012 | rgduval
An ICT solution seems to be overkill for what you've described. What kind of volumes are you hand building? How many components are not marked? What is your current yield with the process you are using? What is/was your yield prior to implementing m
Electronics Forum | Thu Aug 16 12:44:28 EDT 2012 | cobham1
We are currently checking parts on our boards with a digital multimeter to make sure values are correct. This process takes a large amount of time and is very in accurate Can someone please recommend a low capital budget system that is good and repea
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 3010ACL high-speed chipmounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed highquality electric production line of
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Parts & Supplies | SMT Equipment
DEK265 printing security door Applicable models: INFINITY HORIZON if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alic
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Parts & Supplies | Circuit Board Assembly Products
Test card printing images (KXFE00DUA00) of Panasonic if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.co
Technical Library | 2023-01-17 18:07:31.0
To achieve higher levels of consistency in PCB output, process engineers are able to maintain tighter controls and reduce process-related defects by using closed-loop process controls. At every stage of assembly, from screen printing through placement to reflow, closed-loop systems help control the variable factors that can have adverse effects on the process.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Career Center | , | 2001-05-16 16:03:48.0
Work with a fast growing, leading edge technology manufacturer. Must know fluid dispensing profiling screen printing reflow Pay is market agnencies: will split
Career Center | Blackwood, New Jersey USA | Production
Responsibilities include the following: Improve the cost effectiveness, efficiency, and quality of production processes. Develop methods, practices, and processes used to manufacture circuit assemblies. Program Surface Mount Equipment for printed ci
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Coomb's Printed
| https://unisoft-cim.com/view-markup_assembly-docs_printing-assembly-docs.html
Printing Assembly Process Documents | Unisoft Manufacturing Software | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-assembly-process/
. Redundancies and missing parts can also be addressed to cut costs. Solder Paste Printing The first step in the PCB assembly process is solder paste jet printing
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