Graphical CAM software for captive and contract PCB assemblers. GC-PowerPlace accepts Gerber data along with an ASCII BOM file to create and verify assembly equipment programs off-line. Centroids are extracted with sub-micron precision. It can also c
Nanovea offers clients worldwide to an unmatched range of Nano, Micro & Macro Mechanical, Metallurgy, Tribology and 3D Non-Contact or AFM materials characterization. Measurements include: Scratch Adhesion, Indentation Hardness, Wear Friction, Elastic
Career Center | Shanghai, China | Engineering
Responsibilities � Head & manage the SMT engineering team consisting of SMT engineers, EAs and technicians � Provide on-site support & expertise to resolve daily SMT engineering issues so as to ensure smooth & consistent production output & on-time d
Industry News | 2011-08-17 13:41:16.0
Vi TECHNOLOGY is proud to announce the appointment of Russell Claybrook as Regional Sales Manager, effective now.
Industry Directory | Manufacturer
We are a woman-owned small business, and a contract manufacturer, specialing in SMT, through hole, and manual assembly applications. We have 30+ years of electronics experience and assets offshore for high-volume projects.
Events Calendar | Wed Nov 04 00:00:00 EST 2020 - Thu Nov 05 00:00:00 EST 2020 | Montréal, Quebec Canada
ATX Montréal - Automation Technology Expo
Industry News | 2018-08-29 19:50:10.0
KIC today announced that, as part of the company’s ongoing effort to improve product development and to execute its long-term product roadmap, R&D Manager Ryan Wilshusen is taking over leadership of the Product Management (PM) group. Tom Bergeron is the Product Manager for KIC projects related to improving the company’s current product offerings, while Miles Moreau, Global Manager – Products & Technologies, is working with the marketplace and internal KIC team to define the company's product and technology roadmap.
Technical Library | 2015-07-01 16:51:43.0
Aerospace and military companies continue to exercise RoHS exemptions and to intensively research the long term attachment reliability of RoHS compliant solders. Their products require higher vibration, drop/shock performance, and combined-environment reliability than the conventional SAC305 alloy provides. The NASA-DoD Lead-Free Electronics Project confirmed that pad cratering is one of the dominant failure modes that occur in various board level reliability tests, especially under dynamic loading. One possible route to improvement of the mechanical and thermo-mechanical properties of solder joints is the use of Pb-free solders with lower process temperatures. Lower temperatures help reduce the possibility of damaging the boards and components, and also may allow for the use of lower Tg board materials which are less prone to pad cratering defects. There are several Sn-Ag-Bi and Sn-Ag-Cu-Bi alloys which melt about 10°C lower than SAC305. The bismuth in these solder compositions not only reduces the melting temperature, but also improves thermo-mechanical behavior. An additional benefit of using Bi-containing solder alloys is the possibility to reduce the propensity to whisker growth
At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec
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