Electronics Forum | Wed Jun 13 16:09:28 EDT 2007 | rgduval
The parts were soldered in place on the first side. Any recommendations on material for this kind of fixture? I've shimmed boards off the belt before with titanium wave plows...but, I'd love to find something slightly more elegant.
Electronics Forum | Mon Aug 18 15:18:08 EDT 2008 | realchunks
Open the same size as the via's anular ring. Any slight off print will wet its way back into the via hole.
Industry News | 2011-09-12 15:38:48.0
IPC released the summer 2011 edition of its quarterly business report, Electronics Industries Market Data Update, showing slower growth in most national economies as well as in the worldwide electronics industry.
Industry News | 2013-03-12 16:31:06.0
IPC – Association Connecting Electronics Industries®, predicts a modest return to growth in the North American PCB market in 2013.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/no-option-for-pad-roundoff-in-v2021-edition_topic2866_post11454.html
Another slight issue I have found with the way values are rounded (using the Decimal Place Accuracy option) is in the naming of the padstacks
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-introduces-the-new-generation-rollvia-plasma-system
Nordson MARCH Introduces the new-generation RollVIA plasma system for roll-to-roll production in PCB manufacturing operations MARCH Products Corporate | Global Directory
