Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 2012-03-15 17:50:28.0
The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their
Technical Library | 2014-10-09 17:51:35.0
Over the last years more and more international newspapers reported in Europe / USA and Japan: "Tunnel train got stuck under the Channel – thousands of people stranded", "Recall of thousands of cars to workshops for control and repair", "Power Failures left households without energy for hours." Very often news like this relate to malfunctions of electric and electronic circuits under adverse conditions or sometimes even in normal operating environment (...) The presentation will deal with all kinds of aspect of cleaning to ensure the reliability of electronic circuitry in ever changing operation conditions in the most important industrial areas.
Technical Library | 2017-05-04 17:35:01.0
Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials.
Technical Library | 2018-06-18 13:43:56.0
Thermal influences can significantly compromise the service life, capacity and especially the operational safety of HV batteries. In order to prevent damage due to excessive temperatures, large quantities of heat-conducting potting media are used here. Scheugenpflug has developed a new system solution for fast and reliable application of these materials.
Industry News | 2003-04-28 21:29:00.0
Seeking representation in New England area
Industry News | 2005-10-12 17:59:10.0
To provide enhanced service to its customers, Indium Corporation has announced that it has expanded its Sales Team in the western United States.
Industry News | 2007-11-22 17:34:23.0
OSAKA, JAPAN � November 19, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it has been awarded a Global Technology Award with Balver Zinn in the category of Soldering Materials for its innovative SN100C Paste.
Industry News | 2008-02-03 21:37:29.0
San Diego � February 4, 2008 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it is entering its 30th year of business within the electronics industry.
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