MINAMI�s line of screen printers, range from semi- over fully automatic in-line machines to sophisticated systems for the semiconductor industry. The printers demonstrate leading print accuracy and a repeatability of 2.0 Cpk at /-25 �m. Patented tec
New Equipment | Coating Equipment
DC Series – Conformal Coat Dip Systems (Lab, Bench-top, In-line) SB Series – Conformal Coat Spray Booth Systems CR Series – Conformal Coat Removal Systems G3 Dispensing - Automatic Robotic – liquids, pastes or gels
Electronics Forum | Sat Apr 17 02:24:10 EDT 2004 | D. Sanders
What are the lengths/depth/height of these two machines? They will be used in-line with conveyors. Thanks, Doug
Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc
When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A
Used SMT Equipment | Pick and Place/Feeders
Panasonic high-speed mounter NPM-D3 achieves high productivity per unit area in the integrated assembly line mounter & inspection a coherent system to achieve high efficiency and high quality production. Customers are free to choose the actual assemb
Used SMT Equipment | Coating and Encapsulation
Looking to purchase IR curing ovens, at least 4 ones, in-line, Preffered Precision Valve & Automation but will consider other brands.
Industry News | 2010-09-20 19:36:19.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2014-10-22 11:22:28.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Technical Library | 2023-12-18 21:07:29.0
Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board. Nozzles can vary by size (internal diameter) and shape (making them suitable for different process types). This is all dictated by board design and process requirements. Selection of the nozzle type is dependent upon the product to be soldered and the desired cycle time. Examples of different nozzle types are shown here. Hand-load selective systems must be programmed with the parameters for multiple solder joints. However, many in-line systems are designed to be modular. This modularity allows for multiple solder stations with different conditions/nozzles to achieve low cycle times. Figure 1 shows the two distinct types of selective soldering systems offered by Pillarhouse International Ltd.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Heller Industries Inc. | https://hellerindustries.com/inline-pressure-curing-oven-1280/
In-line Pressure Curing Oven Home » Pressure Curing Ovens » PCO 1280 In-line Pressure Curing Oven – PCO 1280 In-line Pressure Curing Oven with dual loaders and 2 magazine capacity used for curing PLP panels. Oven Size (mm): 2,000[W] x 4,850[D] x 2,400[H
| https://www.smtfactory.com/LED-Bulb-Production-Line-in-Egypt-and-Market-Analysis-id3803161.html
LED Bulb Production Line in Egypt and Market Analysis - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch Español
