Technical Library | 2021-12-31 06:56:02.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
Auto stencil cleaning: Standard Specification, including Wet wiping, dry wiping and Exhaust the air. Humanity software: Easy to learn and operate. Blade working under stencil or depart from stencil; it will not move up and down; to ensure the stead
Electronics Forum | Tue Aug 01 13:31:48 EDT 2017 | tey422
There is one thing to be checked too. That is to make sure the nozzle not going too deep when lower to pick up the part. I found a lot of picking errors issues are due to nozzle going down too deep into the pocket. If it does, it pushes the component
Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
