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IPC-2581 Consortium Member Fujitsu Successfully Fabricates Multi-Layer PCB from IPC-2581B Design File

Industry News | 2016-04-07 08:47:23.0

The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.

Association Connecting Electronics Industries (IPC)

XDry Provides Illumina with Affordable Humidity-Controlled Storage

Industry News | 2021-07-21 13:11:04.0

XDry Corp. today announced its association with Illumina, Inc. (NASDAQ:ILMN).

XDry

Revolutionize Storage with Intelligent SMD Tower - I.C.T-ISS2000

Industry News | 2024-01-29 01:52:21.0

In the ever-evolving landscape of Surface Mount Technology (SMT), the I.C.T-ISS2000 stands out as a game-changer in Intelligent SMD Tower. Crafted in Europe, this cutting-edge system adheres to the highest safety standards, making it a reliable choice for safety-conscious electronics manufacturers.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

IPC White Paper Emphasizes the Critical Importance of Data Analytics for the Electronics Manufacturing Process

Industry News | 2024-02-26 14:30:53.0

The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC's Chief Technologist Council (CTC), Outlook for Data Analytics in the Electronics Manufacturing Industry.

Association Connecting Electronics Industries (IPC)

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Unique software for dispensing two-component fluids wins Global Technology Award for ASYMTEK Automated Ratio Calibration (ARC™) Technology

Industry News | 2020-10-12 15:09:12.0

Enables easier set-up and ensures accurate mix ratios by volume or weight to improve overall dispense quality ASYMTEK, a part of Nordson ELECTRONICS SOLUTIONS - a global leader in electronics manufacturing technologies, announces its latest technology has received the Global Technology Award 2020 for fluid dispensing equipment. Nordson Electronics Solutions developed the patent-pending software, Automated Ratio Calibration Technology (ARC™ Technology), to enable easier set-up and sustained mix ratios for dispensing two-component (2K) fluid materials. ARC Technology is part of a system, which includes ASYMTEK Vortik® progressive cavity pumps and ASYMTEK dispensing platforms, that ensures consistently accurate mix ratios by volume or weight to improve overall dispense quality. The award was announced by Global SMT & Packaging magazine during a virtual ceremony held on September 29, 2020.

ASYMTEK Products | Nordson Electronics Solutions

IPC Meeting to Equip EMS Executives with Tools for Success

Industry News | 2003-01-31 16:13:14.0

Will Take Place in Conjunction with IPC SMEMA Council�s APEX� in Anaheim, Calif.

Association Connecting Electronics Industries (IPC)

Breaking Down Language Barriers: IPC-T-50J Now Available

Industry News | 2011-11-11 14:38:51.0

Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)


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