Full Site - : indium 8.9hf lead free paste (Page 2 of 29)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Industry News | 2017-07-17 18:33:56.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2019

Industry News | 2018-03-14 15:03:10.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. Professional development courses will take place January 27, 28 and 31, 2019 and the technical conference will take place January 29–31, 2019.

Association Connecting Electronics Industries (IPC)

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Industry News | 2018-06-20 20:36:50.0

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2020

Industry News | 2019-02-18 17:18:54.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.

Association Connecting Electronics Industries (IPC)

SMTA Annual Awards Announced

Industry News | 2007-10-05 21:28:08.0

MINNEAPOLIS, MN - During the Annual Meeting at SMTA International (Wednesday, October 10th, at the Gaylord palms Resort in Orlando, FL.), the association honored members who have shown exceptional service to the association and the industry.

Surface Mount Technology Association (SMTA)

Indium Corporation

Industry Directory | Manufacturer

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Indium Corporation Features Void-Reducing Solder Paste Indium8.9HF at Productronica

Industry News | 2015-10-27 22:08:05.0

Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Industry News | 2015-11-14 15:34:42.0

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany

Indium Corporation

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Industry News | 2016-04-06 12:15:05.0

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.

Indium Corporation

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Industry News | 2015-11-12 12:08:30.0

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany.

Indium Corporation


indium 8.9hf lead free paste searches for Companies, Equipment, Machines, Suppliers & Information

convection smt reflow ovens

Benchtop Fluid Dispenser
Hot selling SMT spare parts and professional SMT machine solutions

Component Placement 101 Training Course
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Shenzhen Honreal for all your SMT Equipment needs

World's Best Reflow Oven Customizable for Unique Applications