Full Site - : indium 8.9hf lead free paste (Page 8 of 29)

Indium Corporation Experts to Present at IPC APEX Expo

Industry News | 2019-01-08 20:28:27.0

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.

Indium Corporation

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech

Indium Corporation Experts Reflect on 80 Years of Technology Innovation and Growth

Industry News | 2014-03-13 11:57:36.0

What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.

Indium Corporation

Local Man Featured on Cover of Premier Chinese Publication

Industry News | 2005-08-22 18:40:30.0

Indium Corporation�s Vice President of Technology, Dr. Ning-Cheng Lee, is featured on the cover of Electronics Manufacturing CHINA (EM China), the leading Chinese technical publication for the electronics manufacturing industry in China.

Indium Corporation

Indium Corporation Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC

Industry News | 2024-05-20 10:57:52.0

Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.

Indium Corporation

Indium Corporation Experts to Present at IEMT–EMAP 2016

Industry News | 2016-08-30 14:34:00.0

Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.

Indium Corporation

Indium Offers Lead-Free Assembly Solution

Industry News | 2002-04-09 08:02:34.0

QuickStart, Was the Result of More than Two Years of Collaborative Research and Development Between Indium and Motorola

Indium Corporation

Indium Corporation's Jason Chou to Present at SEMICON Taiwan

Industry News | 2023-09-04 13:36:25.0

Indium Corporation Senior Area Technical Manager Jason Chou will present at SEMICON Taiwan on September 7, in Taipei, Taiwan.

Indium Corporation

Indium Corporation�s NF260 Wins Third Prestigious Award

Industry News | 2006-04-17 11:14:44.0

Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia

Indium Corporation

Indium Corporation's SACM™ Provides Superior Drop Shock Performance AND Thermal Cycling Reliability

Industry News | 2013-11-01 13:11:17.0

Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.

Indium Corporation


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