Industry News | 2019-01-08 20:28:27.0
Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.
Industry News | 2014-03-13 11:57:36.0
What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
Industry News | 2005-08-22 18:40:30.0
Indium Corporation�s Vice President of Technology, Dr. Ning-Cheng Lee, is featured on the cover of Electronics Manufacturing CHINA (EM China), the leading Chinese technical publication for the electronics manufacturing industry in China.
Industry News | 2024-05-20 10:57:52.0
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
Industry News | 2016-08-30 14:34:00.0
Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.
Industry News | 2002-04-09 08:02:34.0
QuickStart, Was the Result of More than Two Years of Collaborative Research and Development Between Indium and Motorola
Industry News | 2023-09-04 13:36:25.0
Indium Corporation Senior Area Technical Manager Jason Chou will present at SEMICON Taiwan on September 7, in Taipei, Taiwan.
Industry News | 2006-04-17 11:14:44.0
Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia
Industry News | 2013-11-01 13:11:17.0
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
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