Industry News | 2004-11-19 14:17:48.0
Indium Corporation of America has announced that GPS has become its newest distributor in the European market, covering Germany, Croatia and Slovenia.
Industry News | 2014-03-13 11:57:36.0
What does it take to make it to 80 years in an industry where today's technology is obsolete tomorrow? For Indium Corporation, it takes foresight and dedication.
Industry News | 2013-11-20 12:52:38.0
Indium Corporation is pleased to announce that Pony Liao, area technical manager - Northern China, has earned his Six Sigma Black Belt certification through the American Society for Quality.
Industry News | 2014-12-04 14:02:26.0
Indium Corporation announces that Tim Hults, technical support engineer for global accounts, has achieved the designation of SMTA-Certified Process Engineer.
Industry News | 2005-02-16 21:15:11.0
Indium Corporation of America has announced that PC Trading has become its newest distributor in Europe, covering Denmark
Industry News | 2008-02-28 15:03:16.0
Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time.
Industry News | 2005-09-15 14:43:27.0
Indium Corporation of America announced that CHIMIE TECH SERVICES SA (CTS) has become its newest distributor in Europe, covering France.
Industry News | 2022-07-31 19:44:07.0
Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
Technical Library | 2018-12-19 21:23:59.0
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste.
