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Preview for AdoptSMT - SMT Nuremberg 2016, April 26-28, Stand 7-100

Industry News | 2016-03-07 14:06:37.0

Market Leader AdoptSMT will showcase at SMT 2016 in Hall 7, Stand No. 7-100 an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.

AdoptSMT Europe GmbH

NEPCON South China 2011 to Focus on New Product Innovations

Industry News | 2011-08-01 16:38:05.0

Taking place from August 30 to September 1 at the Shenzhen Convention & Exhibition Center, NEPCON South China 2011 will span nearly 30,000 sqm and attract more than 500 exhibitors from 22 countries and regions.

Reed Exhibitions

Telecommunications Manufacturing Professionals Eye 4G Feast at NEPCON China 2014

Industry News | 2014-03-12 14:46:33.0

MIIT issued 4G licenses to China Mobile, China Telecom, and China Unicom on 4 Dec, marking the beginning of the 4G era in China.

Reed Exhibitions

Indium NC-SMQ92J paste problems

Electronics Forum | Fri Apr 23 08:20:25 EDT 2004 | babe

Sometimes solder balling is related to oxidized paste or paste that has sat on the pcb too long before reflow. Mostly it is related to process, sorry... Too slow or too fast of a reflow ramp rate. Heating up an assembly too quickly will not allow the

Re: Process Change

Electronics Forum | Wed Jun 23 11:47:48 EDT 1999 | Dave F

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Curious on how this thread developed

Electronics Forum | Wed Jun 23 14:23:14 EDT 1999 | Cunli Jia

Dave, Looks like you just replied to Ryan's original question, but the message itself shows that the two of you have been going back and forth. Did you copy from your email discussion? Just curious whether something is going wrong with the Forum.

Non-wettig on chip cap.

Electronics Forum | Mon Dec 10 04:15:01 EST 2001 | Beny

Thanks for your advise Now I don't found Non-wetting defect at TIN COATED 0603 after I had increased peak temp and Time above 183 C. At film caps, I still found Non-wetting in high rate at film chip size 2416. I using PANASONIC's part with identif

I need to reduce costs on solder paste wasted

Electronics Forum | Tue Jul 19 09:18:14 EDT 2011 | davef

Could this be an opportunity to explore the use of cartridge-type paste dispensers? Or maybe a reason to keep working over the weekend. * Re-Storing & Re-Using “Used” Solder Paste. Though not a recommended practice, used solder paste from the stenci

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Hey Ya'll, let's talk about Lead fer' a bit...

Electronics Forum | Mon May 03 18:11:10 EDT 1999 | Steve Gregory

Hi Ya' John! Here's my comeback to the points you've raised...you knew I would have a comeback, didn't ya'? |Steve, | | I see your point, and yes there are alot bigger fish to fry in |the removal or control of lead in the environment. However even


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