940 indium bond using formic acid results

Industry News: indium bond using formic acid (2)

Indium Corporation Introduces New Adhesive Solution for Semiconductor Applications at PCIM Europe

Industry News | 2022-04-20 14:08:21.0

Indium Corporation is announcing the release of InTACK™, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.

Indium Corporation

Laser Bar Bonding with AuSn or Indium on the New Automatic Sub-Micron Bonder FINEPLACER� FEMTO

Industry News | 2007-11-27 12:28:45.0

FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.

Finetech

Express Newsletter: indium bond using formic acid (938)


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