Full Site - : inner layer separation (Page 10 of 46)

Bicheng High CTI printed circuits

Bicheng High CTI printed circuits

Parts & Supplies | Circuit Board Assembly Products

1) 160*100mm, FR-4 CTI ≥ 600V 2) 8 layer impedance control 3) Copper weight(finished inner/outer): 1 oz 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel

Bicheng Enterprise Company

BICHENG Fine-pitch BGA PCB

BICHENG Fine-pitch BGA PCB

Parts & Supplies | Circuit Board Assembly Products

1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA

Bicheng Enterprise Company

2929 Bondply - Advanced Circuit Laminate

2929 Bondply - Advanced Circuit Laminate

New Equipment | Materials

2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.  A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit

Rogers Corporation

Modelling of Thermal Stresses in Printed Circuit Boards

Technical Library | 2011-10-20 22:03:30.0

Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.

Tomas Bata University

Cavity Boards

New Equipment |  

Cavity boards are multilayer designs that expose inner layers to air by requiring pockets of material to be cut out. This requires laminating precut materials, controlled-depth fabrication, tight processing controls, and manufacturing versatility. Al

Saturn Electronics Corporation

Enhanced reflow cooling technology introduced by Rehm Thermal Systems

Industry News | 2010-03-15 13:23:37.0

Rehm Thermal Systems has introduced new cooling zone designs for their Vision Series convection reflow ovens. The new technology is particularly effective for the homogenous cooling of large thermal mass PCBs.

Rehm Thermal Systems Korea Limited

Auspi Enterprises Co., Ltd

Industry Directory | Manufacturer

Auspi Enterprises Co., Ltd., one of the professional suppliers of printed circuits in China. We found your company info on the web knowing that you're dealing with electronics, which we think you may have demand on pcbs.

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

Tropical Stencil

Industry Directory | Consultant / Service Provider / Manufacturer

Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited


inner layer separation searches for Companies, Equipment, Machines, Suppliers & Information

ISVI High Resolution Fast Speed Industrial Cameras

High Throughput Reflow Oven
PCB Handling with CE

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World's Best Reflow Oven Customizable for Unique Applications
Pillarhouse USA for Selective Soldering Needs

High Resolution Fast Speed Industrial Cameras.