Full Site - : instruments 10pc board (Page 2 of 604)

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

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CirTran Further Expands Domestic Sales Capacity to Over 40 Representatives

Industry News | 2003-03-12 08:14:19.0

Today announced the addition of two leading electronics sales representative firms designed to increase CirTran's domestic sales volume.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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