Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Wed Apr 13 21:17:18 EDT 2022 | stephendo
If it was ROHS, I would say that the pads are definitely dissolved away. And it sounds like that is the case here. Your best bet is if it is class 2 and the barrels are at least 50% then push for them to be accepted. If you are trying for more barr
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. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
: dispense tubes and parts, filters, seals, and fittings.These items originate from the dispense pump, syringe, and external fill. WARNING Recommended decontamination and decommissioning procedures
