Full Site - : insufficient solder at reflow process (Page 14 of 66)

BTU International to Present at SMTA Upper Midwest

Industry News | 2010-05-29 18:30:13.0

NORTH BILLERICA, Mass., May 27, 2010—BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment to the alternative energy and electronics manufacturing markets, today announced that Rob DiMatteo, Regional Sales Manager, will present a paper titled “Reducing Reflow Costs in a Challenging Economy” at the upcoming SMTA Upper Midwest Expo and Tech Forum. The presentation is scheduled to take place on Wednesday, June 9, 2010 at the Sheraton Bloomington Hotel in Bloomington, MN.

BTU International

Nihon Superior’s Keith Sweatman to Present at SMTA International

Industry News | 2012-09-17 16:26:16.0

Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012

Nihon Superior Co., Ltd.

Indium Corporation Features Ultra-Low Voiding Solder Paste at Productronica

Industry News | 2007-10-23 17:27:36.0

Indium Corporation�s *Indium5.1AT Pb-Free Solder Paste *is an Award-Winning No-Clean, Pb-Free Solder Paste that delivers enhanced finished goods reliability by featuring;

Indium Corporation

SHENMAO Shows High-Rel Solder Paste at SMTA Guadalajara

Industry News | 2022-08-26 09:15:23.0

SHENMAO America, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The company will showcase its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste can increase thermal reliability performance by a minimum of 30 percent.

Shenmao Technology Inc.

SHENMAO to Exhibit Low-Temperature Solder Pastes at ECTC

Industry News | 2019-04-15 06:42:26.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.

Shenmao Technology Inc.

Indium Corporation Technology Expert to Present at Yamaha Technology Day.

Industry News | 2014-09-04 23:32:50.0

Indium Corporation's Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany.

Indium Corporation

Indium�s Dr. Lee and Dr. Lasky to Present at APEX

Industry News | 2005-01-11 11:17:37.0

Indium Corporation�s VP of Technology, Ning-Cheng Lee, Ph.D and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will both be presenting courses on Pb-Free electronic assembly at APEX in Anaheim, CA in February.

Indium Corporation

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

Industry News | 2017-05-22 17:36:43.0

KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled, “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach” at 2:30 p.m. on Wednesday, June 7, 2017 at the Edward Village Markham in Ontario.

KYZEN Corporation

Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX

Industry News | 2022-01-03 07:24:21.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.

Nihon Superior Co., Ltd.

Kurtz Ersa Wins Four NPI Awards at APEX

Industry News | 2016-03-15 16:00:03.0

Kurtz Ersa North America announces that it was awarded four 2016 NPI Awards during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO. Ersa won in the following categories: Component Placement – Multi-function for the ROBOPLACE, Soldering – Selective for the VERSAFLOW 4, Soldering – Reflow for the HOTFLOW 3/20 and Software – Process Control for the IMAGESOFT Software.

kurtz ersa Corporation


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