New SMT Equipment: insufficient solder on bga (3)

X3 3D X-Ray - Automated In-line X-Ray Inspection System

X3 3D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol

Nordson YESTECH

X2 2D X-Ray - Automated In-line X-Ray Inspection System

X2 2D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i

Nordson YESTECH

Electronics Forum: insufficient solder on bga (210)

Scratches on BGA solder resist

Electronics Forum | Tue Feb 27 20:17:19 EST 2007 | roderickray

I have been trying to tell people at work that minor scratches on solder resist on BGA will not effect functionality of BGA, instead they want to attempt repair of these scratches. Any suggestions.

Scratches on BGA solder resist

Electronics Forum | Wed Feb 28 07:40:26 EST 2007 | realchunks

Hi Roderick, Guess it depends on how you define "minor". If it is just a visual blemish in the mask, there will be no affect o the BGA. If it is through the resist there may be a chance of solder shorting, which will affect it, I doubt it but poss

Used SMT Equipment: insufficient solder on bga (3)

Mirtec MV-3L 2D AOI

Used SMT Equipment | AOI / Automated Optical Inspection

2011 MIRTEC MV-3L PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13110930-0839 DOM: 30 SEP 2011 2D Inspection Power: 85-264V / 4.4A / 50-60 Hz INSPECTION AREA: 450 x 400 mm INSPECTION ITEMS:&n

Fortunetech Inc.

Mirtec MV-3U

Mirtec MV-3U

Used SMT Equipment | AOI / Automated Optical Inspection

2015 MIRTEC MV-3U LARGE PCB AOI MACHINE IS IN GOOD WORKING CONDITION AND CAN BE DEMO'D IN PERSON OR VIRTUALLY! SN: 13150216-1452 DOM: 16 FEB 20152D Inspection​5 Camera Inspection SystemPower: 85-264V / 4.4A / 50-60 HzINSPECTION AREA: 660mm x 510 mmIN

Fortunetech Inc.

Industry News: insufficient solder on bga (52)

SMTA Announces International Conference on Soldering and Reliability (ICSR) Program

Industry News | 2012-03-08 22:21:34.0

The SMTA is pleased to announce the program for the 2012 International Conference on Soldering and Reliability being held May 15-18 in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.

Surface Mount Technology Association (SMTA)

Parts & Supplies: insufficient solder on bga (1)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Technical Library: insufficient solder on bga (9)

Possible reasons for simultaneous solder skip and short circuit of BGA

Technical Library | 2018-11-07 03:31:04.0

Generally speaking, there are not many cases of insufficient solder and solder short in BGA soldering, but it is not impossible. Here we discuss some elements may cause it

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling

Technical Library | 2016-11-30 21:30:50.0

Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.

Henkel Electronic Materials

Videos: insufficient solder on bga (7)

In Line 3D X-Ray

In Line 3D X-Ray

Videos

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol

Nordson YESTECH

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production.

Videos

This is a demonstration of the YESTech YTX-X3 3D X-Ray inspecting pcbs in production. This YTX-X3 is available at the Capital Equipment Exchange. https://www.ce-exchange.com/details/?product=7426&pn=YESTech-YTX-X3-3D-X-Ray

Capital Equipment Exchange

Training Courses: insufficient solder on bga (1)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Career Center - Resumes: insufficient solder on bga (1)

Global Product Specialist

Career Center | Singapore, Singapore | Engineering,Production

I am a result/goal-oriented engineer with 20 years of experience in Surface Mount Technology (SMT) environment, of which 7 years were heavily involved in field service and field application for Automated Optical Inspection (AOI) machines. I partici

Express Newsletter: insufficient solder on bga (985)

SMT Express, Volume 2, Issue No. 6 - from SMTnet.com

SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid

SMTnet Express July 25 - 2013, Subscribers: 34972

solder-related defects on high-temperature therm

Partner Websites: insufficient solder on bga (7149)

SolderTip #46: Open Connections Found on BGA Components | EPTAC

| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/

SolderTip #46: Open Connections Found on BGA Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing

GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-underfill.php

Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing   Home   Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader

GPD Global


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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

Circuit Board, PCB Assembly & electronics manufacturing service provider

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pressure curing ovens

High Throughput Reflow Oven
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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
Solder Paste Dispensing

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