Industry News | 2022-11-28 07:00:51.0
With the development of the precision and stability of SMT equipment, the manufacturing process and testing links have gradually become the key to the development of the industry. At the same time, the fierce competition in the consumer electronics market has put forward higher requirements for the quality of electronic components. In the production process, it is necessary to use various testing technologies to inspect defects and faults in time and repair them, among these testing technologies, X-ray inspection is one of the most critical process to improve the SMT BGA QFN soldering quality.
Industry News | 2023-10-23 10:03:02.0
At productronica in Munich, Germany, taking place from November 14 to 17, 2023, Viscom AG will present for the first time its latest high-end iS6059 Double-Sided Inspection system. At Viscom's Booth A2.177, visitors to the world's leading trade fair for electronics manufacturing can learn more about the advantages of simultaneous optical assembly inspection from above and below using the new machine's special features.
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Industry News | 2018-10-18 08:39:14.0
Stencil Technology for SMT production
Industry News | 2019-10-02 13:53:10.0
10.03.2019 – Atlanta – Koh Young America proudly introduces its latest True 3D Automated Optical Inspection (AOI) platform – the Zenith Alpha. Driven by the increasing need to inspect and measure densely populated boards at faster speeds, Koh Young leveraged its award-winning and proven technologies to deliver a new solution. The Zenith Alpha is suitable for myriad manufacturers, including smaller companies just realizing how 3D measurement can improve the board assembly process yield.
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
Industry News | 2011-02-22 14:43:18.0
Christopher Associates Inc. announces that Chrys Shea, Consulting Engineer, will give a presentation titled “Troubleshooting the Stencil Printing Process” at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX, and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.
Industry News | 2012-01-20 15:02:15.0
SEHO Systems GmbH will highlight the new AOI function for its best-selling selective soldering system – the PowerSelective - in Booth #3521 at the upcoming IPC APEX Expo.
Industry News | 2016-12-29 06:43:55.0
Conformal Coating Photo Album CD-ROM The photo CD-ROM album featuring over 280 colour images on conformal coating, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents and standards. The photo CD covers many of the defects listed:
