Industry News | 2012-03-14 11:22:16.0
SEHO Systems will exhibit PowerSelective soldering system in booth #1A87 at the upcoming NEPCON China 2012.
Industry News | 2015-01-21 19:33:11.0
PARMI will showcase solutions for improving the assembly process and equipment ROI at the IPC APEX EXPO, being held in San Diego, CA, February 22-26, 2015.
Industry News | 2024-02-26 14:00:02.0
High-performance memory supplier chooses Saki's 3Si solder-paste inspection and 3Di inline AOI systems to handle miniaturization challenges and prepare for smart manufacturing.
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Industry News | 2021-04-21 10:17:09.0
Seoul, South Korea – At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2021-04-29 16:58:08.0
At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2012-04-27 08:43:28.0
SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Soldering Systems – Auxiliary for the new AOI function for its best-selling selective soldering system – the SEHO PowerSelective
Industry News | 2012-03-07 16:45:06.0
SEHO Systems has been awarded a 2012 NPI Award in the category of Soldering - Selective for the new AOI function for its best-selling selective soldering system - the SEHO PowerSelective.
Industry News | 2019-02-06 08:53:54.0
Chandler, Arizona – Not even the “polar vortex” could stop Koh Young America from holding a highly successful IPC APEX Expo in San Diego during the last week of January 2019. “Despite the weather in the Midwest and New England, Koh Young America is very pleased with the outcome from the IPC APEX Expo,” said Juan Arango, Managing Director at Koh Young America.
