Electronics Forum | Thu May 06 19:13:24 EDT 2004 | Greg York
Watch your dwell time especially if larger components. Problem is normally associated with lower temp as well as insufficient flux coverage with larger massed boards or ground planes. Try to hand spray a board to check that fluxer operation is OK. If
Electronics Forum | Thu May 05 09:50:29 EDT 2005 | patrickbruneel
Hi Hannu, You just gave a very realistic and practical view of the lead-free dilemma. The main reason that your coil coating doesn't get removed is because of the inability of lead free alloys to wet the surface and conduct the heat. Higher temperat
Electronics Forum | Thu Sep 06 17:37:05 EDT 2007 | hakerem
Hi Joris - There is an excellent wave solder guide called "Take No Prisoners" that includes instructions for attacking and eliminating solder balls and preventing their recurrence: 1. Increase Dwell Time Solder balls are normally caused by too much f
Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds
Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.
Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc
5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht
Electronics Forum | Tue Dec 08 15:19:42 EST 2015 | proceng1
Apply the correct amount of paste for the pad size should work ok, as long as the part starts out in the paste. If you have a reduced aperture and the leg doesn't quite touch any paste could result in non-wetting or insufficient solder issues. I gu
Electronics Forum | Fri Apr 04 09:54:39 EDT 2008 | redtiger56
We have been seeing continued difficulty with solder shorts and/or insufficient barrel fill with our Juki selective solder machine while using SAC305. We want to switch to something in the SN100 series, but we do not know enough to seperate the hype
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Wed Aug 11 07:41:52 EDT 2004 | gregoryyork
Check cure of solder resist. Use a No clean low solids rosin flux this will stop problem. Should see almost zero solder balls if put through a single wave compared to a dual wave. If this is true then it is a resist issue and cannot 'resist' the sold
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
