Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Description: • Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up. • Able to identify and touch up poor wetted solder joints, solder voids / i
Career Center | Oldsmar, Florida USA | Engineering,Maintenance,Production
Job Title: Assembler 2 – IPC 610 – 1st Shift Address: 3655 Tampa Rd, Oldsmar FL 34677 Duration: 1 year Pay Rate: $15-$18 Hours: 9/80 schedule Monday – Thursday 6:00AM – 3:30PM, Friday 6:00AM to 2:30PM Job Description: Use microscope to verify
Industry News | 2012-01-20 15:02:15.0
SEHO Systems GmbH will highlight the new AOI function for its best-selling selective soldering system – the PowerSelective - in Booth #3521 at the upcoming IPC APEX Expo.
Industry News | 2012-03-14 11:22:16.0
SEHO Systems will exhibit PowerSelective soldering system in booth #1A87 at the upcoming NEPCON China 2012.
Industry News | 2012-03-07 16:45:06.0
SEHO Systems has been awarded a 2012 NPI Award in the category of Soldering - Selective for the new AOI function for its best-selling selective soldering system - the SEHO PowerSelective.
Industry News | 2012-04-10 15:42:07.0
SEHO Systems GmbH will showcase the new AOI function for its best-selling selective soldering system - the SEHO PowerSelective
Industry News | 2012-04-27 08:43:28.0
SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Soldering Systems – Auxiliary for the new AOI function for its best-selling selective soldering system – the SEHO PowerSelective
