Industry News | 2010-04-28 20:24:38.0
NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Rich Brooks held a successful presentation at the SMTA Silicon Valley Chapter meeting, which took place on Thursday, April 22, 2010 from 3-5:30 p.m. at EET, Inc. in Reno, NV.
Industry News | 2013-03-18 10:28:43.0
SEHO Systems GmbH,will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
High Value Stencil Screen Printing Solutions from JUKI. The PMAXII printers utilize a patented mathematical calculating algorithm to ensure the machine's high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision
ITW EAE MPM Edison Printing System
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Excessive torque can cause damage while insufficient torque can pose a safety risk. In machining and delicate assembly work, it is extremely important to be able to control the tightening torque for screws. PB Swiss Tools, a leading partner for qual
Industry News | 2011-11-03 21:29:45.0
ViTrox Technologies announces that its V810 Automated 3-D In-Line X-ray Inspection System has been selected as a finalist for the 2012 Best in Test Awards.
Industry News | 2016-12-29 06:43:55.0
Conformal Coating Photo Album CD-ROM The photo CD-ROM album featuring over 280 colour images on conformal coating, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents and standards. The photo CD covers many of the defects listed:
