Electronics Forum | Sun Nov 24 09:54:24 EST 2002 | davef
On a HASL board that has poor wetting on the pad, consider looking further downstream in the process than your assembly shop. For instance, take a look at the bare boards. Look for solder mask bleed onto the pads. This will show-up on the outside
Electronics Forum | Thu Aug 27 13:14:49 EDT 2009 | ghepo
I have already told you that is not possible solve this problem by e-mail, without perform a detailed failure analysis. Also I have told you to procede by exclusion. Are you sure, by tests, regarding the PCB quality ? Are you sure regarding the solde
Electronics Forum | Tue Dec 08 15:19:42 EST 2015 | proceng1
Apply the correct amount of paste for the pad size should work ok, as long as the part starts out in the paste. If you have a reduced aperture and the leg doesn't quite touch any paste could result in non-wetting or insufficient solder issues. I gu
Electronics Forum | Thu May 05 09:50:29 EDT 2005 | patrickbruneel
Hi Hannu, You just gave a very realistic and practical view of the lead-free dilemma. The main reason that your coil coating doesn't get removed is because of the inability of lead free alloys to wet the surface and conduct the heat. Higher temperat
Electronics Forum | Fri Oct 19 18:30:05 EDT 2012 | hegemon
When using AOI for through hole you can expect to be able to detect, depending upon whether inspecting from the solder side or the destination side: Polarity (if applies) Value (if marked) Presence (should be there) Non-Presence (should NOT be there)
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Tue Sep 28 17:56:02 EDT 2004 | Vee Sar
Adam, I would first check hole to lead sizes on the components that you are having hole fill issues with to see that the spacing is withing spec. Second, check for oxides on lead tips, and contaminated leads that cause poor wetting and insufficient
Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F
Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w
Electronics Forum | Wed Aug 09 15:06:17 EDT 2023 | SMTA-64386426
The first thing I do when looking at a part relative to stencil design, is determine the coplanarity per the data sheet. Ideally your stencil thickness should be equal to, or if needed, greater than the coplanarity. You want the solder paste to com
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
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