Electronics Forum | Wed Dec 09 10:45:56 EST 2015 | huske
I've put down a SOT223, close enough to your 3pin transistor, in the same situation you have. The large pin was to be soldered on a large exposed ground plane in the corner of a board, over 2"x2" exposed area. We left the paste file as is, so where
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Electronics Forum | Tue May 31 09:40:23 EDT 2005 | mattkehoe
We have some boards that exhibit poor solder wetting when reflowed. Nothing fancy, smallest pitch size .050. See photo's at http://www.sipad.net/SnPbwetting.htm Is this ; Contamination on the HASL finish? Insufficient solder,not enough to cover pad
Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon
| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Fri Apr 15 14:25:57 EDT 2011 | ryanr
We've received in a batch of ICs (Xilinx FPGAs) from a customer on consignment that are having wetting issues. I believe the chips are contaminated. We also know that the chips were bought from a broker. Is there a method to remove the contamination
Electronics Forum | Mon Jun 05 18:45:07 EDT 2017 | zsoden
Hi Steve, I agree with your assessment, it would certainly seem like the pads are de-wetting. But what could be the cause of this? Contaminated solder? The boards are new out of vacuum sealed bags (with desiccant sachets), so I can't see it being the
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
