Electronics Forum | Sun Nov 24 10:12:44 EST 2002 | kcorrin
Thanks for your response Dave. I did look at the bare boards after wave solder and they seem to solder fine in that process. I do not see any soldermask bleed on bare boards. Regarding "thin" plating...I have had issues in the past when the board sup
Electronics Forum | Fri Oct 14 09:21:36 EDT 2005 | lupo
According with temperature vs. wetting force diagram 245-250C/degrees is better, so lower temperature than 500F means better solder fill. If the speed is too lower the solder suck out form the hole. Usually 120-150cm/min. is good. (2-4s contact
Electronics Forum | Tue Oct 21 11:42:04 EDT 2008 | arosario
Hi Shooter, we're not using AOI but we do every 30 minutes sampling Inspection on the board and we're not seeing insufficient paste deposit so far since we started. But I agree with you that seemed my printer is not printing consistent amount of pa
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Fri Oct 19 18:30:05 EDT 2012 | hegemon
When using AOI for through hole you can expect to be able to detect, depending upon whether inspecting from the solder side or the destination side: Polarity (if applies) Value (if marked) Presence (should be there) Non-Presence (should NOT be there)
Electronics Forum | Tue Dec 08 15:19:42 EST 2015 | proceng1
Apply the correct amount of paste for the pad size should work ok, as long as the part starts out in the paste. If you have a reduced aperture and the leg doesn't quite touch any paste could result in non-wetting or insufficient solder issues. I gu
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Fri Apr 06 10:43:57 EDT 2007 | flipit
Hi, Anyone seeing difficulty is soldering MLFs or QFN with lead free solder? I have an MLF with 3 rows of pads on each of the 4 sides of the part and then the large center ground plane in the middle. The part is 20 mil pitch. Had good luck with l
Electronics Forum | Fri Jul 18 14:36:17 EDT 2008 | proy
I have a QFN which we are adding after process. (it was not available the day we ran the 4 prototypes.) We have removed most of the solder on all the pads, My plan was that a LITTLE solder on the center pad would wet and center the device (using a g
Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
