Parts & Supplies | X-Ray Inspection
CT81 HV Disc Ceramic Capacitor 2KV~50KV, 10pf~50000pf CT81 High Voltage Disc Ceramic Capacitor, High Voltage Disk Ceramic Capacitor, HV disc ceramic capacitor, 20KV radial disc ceramic capacitor, 30kv axial ceramic capacitor, 50kv axial disc ceramic
Industry News | 2012-11-22 03:27:45.0
The clinic is organized by IPC and National Physical Laboratory
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Industry News | 2021-10-21 05:56:39.0
Magnalytix announces that it will launch a new educational campaign on its media platforms with videos regarding how surface insulation resistance (SIR) testing works and why it is so valuable.
Industry News | 2022-06-28 09:47:45.0
Gen3 a British manufacturer of testing and measuring the electronics industry announced that Dr Chris Hunt, CTO, has written a paper for SMTA on a gage study of an intercomparison evaluation to implement the use of fine-pitch test patterns for surface insulation resistance (sir) testing of solder fluxes.
1) Our main products are : Pin Header Female Header Box Header Ejector Header Mini Jumper IDC connector(Flat Cable) Wafer connector Housing IC Socket connector 2) Key Specs (or Customize designed) : Type:SMT,Straight,Right-Angle style Main Pi
1) Our main products are : Pin Header Female Header Box Header Ejector Header Mini Jumper IDC connector(Flat Cable) Wafer connector Housing IC Socket connector 2) Key Specs (or Customize designed) : Type:SMT,Straight,Right-Angle style Main Pi
1) Our main products are : Pin Header Female Header Box Header Ejector Header Mini Jumper IDC connector(Flat Cable) Wafer connector Housing IC Socket connector 2) Key Specs (or Customize designed) : Type:SMT,Straight,Right-Angle style Main Pi
Industry News | 2024-05-29 01:09:20.0
Our Comformal Coating ensures circuit board integrity, offering superior insulation, chemical resistance, and UV stability in a thin layer.
Industry News | 2023-08-21 12:19:15.0
Gen3, a global leader in SIR (Surface Insulation Resistance), CAF (Conductive Anodic Filament), solderability, ionic contamination, and process optimization equipment, along with Zestron, renowned experts in cleaning and reliability solutions, are thrilled to announce an enlightening workshop focused on Electronics Manufacturing Processes: Where Quality Assurance Meets Surface Reliability. This informative seminar is scheduled to take place on Wednesday, September 6, 2023, at the Manufacturing Technology Centre in Ansty Park, Coventry.