Industry News | 2019-02-18 17:18:54.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.
Industry News | 2019-09-10 13:25:11.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.
Industry News | 2020-03-08 16:23:52.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23-28, and the technical conference will take place January 26-28, 2021.
Industry News | 2016-04-29 11:38:38.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.
Industry News | 2013-03-29 07:29:36.0
IPC – Association Connecting Electronics Industries® has opened registration for the IPC/FED Conference on Embedded Components, a forum for designers, manufacturers, suppliers and end-users of embedded component technologies to discuss the latest technological advancements.
Used SMT Equipment | Pick and Place/Feeders
Manncorp MC385V2-V Pick and Place Vintage: 2014 Details: Windows 7 Professional Operating System Dual Placement Heads Placement Rate (IPC-9850): 5,500 CPH
Used SMT Equipment | Pick and Place/Feeders
Windows XP Professional Operating System Single Placement Head Placement Rate (IPC-9850): 4,000 CPH Placement Rate Max: 5,000 CPH Min Component Size: 01005 Max Component Size: 100mm x 150mm Max Component Lead Pitch: 0.3mm BGA/CSP Placement Capability
Industry News | 2002-04-16 10:51:48.0
On Several Leading-edge Technologies for the Technical Program of Next Year�s IPC Printed Circuits Expo
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Used SMT Equipment | Pick and Place/Feeders
JUKI High-Speed Compact Modular Mounter RX-8 Features ▶High-speed placements of up to 100,000 CPH.*¹ ▶Best-in-class placement rate per square meter(sq ft).*² ▶Integrates seamlessly with the production enviroment. ▶Trace Monitor tracks quali
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