SOS Inventory Software provides top-of-the-line inventory control, order management, and manufacturing for a wide variety of industries, plus integration with QBO, UPS, ShipStation, Shopify, BigCommerce, Zapier and PayPal.
Industry Directory | Equipment Dealer / Broker / Auctions
Qersa Technology Co., Ltd. is a high-tech enterprise that integrates scientific research, production, sales, and service. Our main business is to provide SMT Assembly Line Equipment, offering overall equipment solutions
Convection Reflow Oven The World's Best Convection Reflow Oven for High-Throughput The New reflow oven platform revolutionizes the Convection Reflow Oven / Reflow Soldering industry with several new and ground breaking designs! The MK7 convecti
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Used SMT Equipment | AOI / Automated Optical Inspection
2014 Mirtec MV-7 Omni In-line AOI Machine Make: Mirtec Model: MV-7 Vintage: 2014 Description: In-line AOI Details: Five Camera 2D/3D In-Line AOI SystemExclusive FIFTEEN MEGA PIXEL ISIS® Vision SystemAdvanced Six Phase Color Lighting Technology10 Micr
Used SMT Equipment | SMT Equipment
Model No：KS-6004-S Portable conveyor Cycle time：Approx 15seconds Power supply：100-230V AC (customized), single phase Power load：Max 150V/A Air pressure： 4-6 bar Air volume：MAX 10L/minute Transport height：900±20mm (or customized) Transport di
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Mon May 16 18:30:00 UTC 2022 - Wed May 18 18:30:00 UTC 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Events Calendar | Mon Apr 20 18:30:00 UTC 2020 - Wed Apr 22 18:30:00 UTC 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Charlotte, North Carolina USA | Accounting/Finance
Financial Analyst (Integration Consultant) Will be responsible for developing and documenting a systematic approach for new acquisitions to be integrated into Financial Shared Services. Must understand the capabilities and processes within the FSS
Career Center | Hudson, Massachusetts USA | Sales/Marketing
Seasoned, sucessful Sales Rep, or Sales Rep organization wanted to represent Altronics Manufacturing Inc. Altronics is a new, well-funded company with a state of the art manufacturing facility, and an outstanding Engineering and Manufacturing staff
Career Center | Imus Cavite, PH Philippines | Engineering,Maintenance,Production,Technical Support
Equipment technical support with over fifth ten years experience providing technical assistance to business professionals and transferable skill. Demonstrate ability to integrate mechanicals, pneumatics and electronics skill. Skilled
Career Center | Cabuyao Laguna, Philippines Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support
- Experience running automated SMT placement equipment (MyData preferred).The operation, preventive maintenance and process assurance of a SMT manufacturing line. - Repairs major equipment breakdown/malfunction of modular and turret
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
