Industry Directory | Distributor
We are Selling Large Qty Of Brand New mobile phones laptpos plama TV with full Accessories {4gb/6gb/15gb/20gb/30gb and 60} also Mp3 Player, Mp4 Players with other Kinds of Ipods at Cheaper and affordable Prices.
High performance Unversal Programmer Advanced Universal LAN Programmer High programming speed for large eMMC devices Supports Intel LR1 and LR2 eMMC modules (up to 64 GB) Powerful new algorithm to program up to four chips simultaneously Custo
Overview The D8254 is a programmable interval timer/counter, binary compatible with industry standard 82C54. The D8254 solves one of the most common problems in any micro-computer system, the generation of accurate time delays under software control
Electronics Forum | Tue Sep 30 17:56:38 EDT 2008 | davef
Some of the popular handheld digital microscope seem to be aimed at home science projects. Units that are priced similar to the Bodelin Technologies ProScope are: * Celestron 44300 Handheld Digital Microscope * Orion Microxplore PC200 Digital Handhe
Electronics Forum | Thu Jun 24 22:22:06 EDT 1999 | Dave F
Problems with downloading papers from the library not withstanding, downloading other papers in the library is problematic, as follows: Understanding SP440 Heating & Vacuum Functions Credit/ Source: LEO HUERTA, TECHNICAL SERVICES ENGINEER Works fi
Used SMT Equipment | AOI / Automated Optical Inspection
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Used SMT Equipment | AOI / Automated Optical Inspection
S/N 60075 & S/N 60076 These 2 units came off the production floor in full operation. They were properly shut down secured and shipped to the Midwest warehouse and a dual set of Calibration Jigs are also available. Inspection available upon requ
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2016-04-20 17:01:57.0
Top executives from leading electronics companies across the United States are calling on Congress to support policies to promote advanced manufacturing, as they gather in Washington, D.C. this week for “IMPACT Washington, D.C. 2016.”
Technical Library | 1999-05-07 09:56:38.0
The purpose of building a supercomputer is to provide superior performance on real applications. In this paper, we describe the performance of the Intel TFLOPS Supercomputer starting at the lowest level with a detailed investigation of the Pentium® Pro processor and the supporting memory subsystem.
Technical Library | 1999-05-07 10:22:03.0
The MMX™ technology is an extension to the Intel Architecture (IA) aimed at boosting the performance of multimedia applications. This technology is the most significant IA extension since the introduction of the Intel386™ microprocessor. The challenge in implementing this technology came from retrofitting the new functionality into existing Pentium® and Pentium® Pro processor designs.
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
SMTnet Express, October 8, 2015, Subscribers: 23,566, Members: Companies: 14,685, Users: 39,104 Preparing for Increased Electrostatic Discharge Device Sensitivity Julian A. Montoya; Intel Corporation With the push for ever improving performance
| https://unisoft-cim.com/customer.php
Incorporated* Innovative Manufacturing Source Incorporated (IMS) – Canada* Input / Output Inrange Technologies Insight Technology Solutions GmbH – Germany InstruTech Incorporated Intel Intel Technology — Malaysia IntelliPower Incorporated Interconnect Solutions
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. A benchmark paper by Intel [7] first openly discussed the use of indium metal as a thermal interface material. The metallizations of the back side of the die and lid provide the soldering surfaces to reliably join silicon to copper with indium
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