Industry News | 2021-06-15 04:22:53.0
IPCs Connected Factory Exchange (CFX) standard defines communication between processes and devices for Industry 4.0. MIRTEC and Optel Software worked together to develop a CFX based interface between MIRTEC's AOI machines and Optel Software's MES system. The goal was to implement full AOI process control at test it at their mutual customer site, VIRTEX plant in Dallas, TX. The resulting CFX interface is vendor independent and will allow MIRTEC to interface with other MES systems, and Optel Software to interface with other AOI machines, with no changes.
Industry News | 2003-06-09 09:41:14.0
Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2003-04-11 08:53:18.0
This agreement establishes PCS as the exclusive representative of RSI in the UK and the Republic of Ireland.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Industry News | 2003-02-26 08:37:36.0
An extended-height press-fit compliant pin SCA-2 receptacle is the latest addition to the SCA-2 product family.
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2003-04-22 09:33:13.0
Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
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