Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
Industry News | 2017-02-13 13:22:05.0
Metcal’s CV-5200 Connection Validation™ Soldering Station provides real-time closed loop feedback on intermetallic compound formation— the world’s first. Plus, a new communication port enables process traceability and firmware upgrades.
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Industry News | 2018-10-11 19:50:17.0
Metcal is pleased to introduce the new CV-500 Connection Validation™ Soldering System, the companion station to the CV-5210 CV Soldering System. The CV-500 packs all of the Connection Validation technology into a compact, economical housing.
Industry News | 2009-01-23 17:20:22.0
OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces SN100C high-reliability lead-free solder spheres.
Industry News | 2012-02-15 19:03:23.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference. The presentation will take place during the session, titled “Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications”.
Industry News | 2013-09-17 15:25:45.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.
Industry News | 2017-11-15 20:16:33.0
Metcal announces that it was awarded a 2017 Global Technology Award in the category of Hand Soldering for its CV-5200 Soldering and Rework Systems with Connection Validation technology. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. This marks the company’s fifth award since its introduction at the beginning of 2017.
Industry News | 2011-05-19 17:07:57.0
Indium Corporation's Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course at the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 31-June 3, 2011.
