Electronics Forum | Fri Oct 20 10:15:13 EDT 2006 | wrongway
mid chip solder balls we had that trouble for awhile we went from a 8 mil thick stencil to 6 mil stencil and did some home plate style of cut outs in the stencil for the 1206 caps and resistors it seemed to fix our mid chip solder balls
Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
Electronics Forum | Wed Nov 29 17:05:15 EST 2006 | slthomas
I have used a 10% area reduction with home plates on 6 mil stencils with good success. If you're using 5 mil stencils you might go with 0 or 5% reduction.
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Thu Jun 21 07:21:26 EDT 2007 | chrispy1963
5 mil is perfect for 0402's. If you are printing SnPb solder use apeture reduction such as home plating the pads. However, if youre using SAC, we've found that printing the entire pad works best due to poor wetting compared to SnPb paste. Chris
Electronics Forum | Wed Apr 09 21:41:28 EDT 2008 | diesel_1t
openings, rectangular no home plate. pad spacing don't have data right now. the problem is those products have from 1 year to 5, running constantly whitout problems and observe the issue around 3 lines no matter of the product.
Electronics Forum | Tue Apr 21 16:33:06 EDT 2009 | llaerum
Home plate design is great for avoiding beads and tombstoning in some cases, but it will not help you when the spacing is too far apart. It will make it worse. You need a good even screen and accurate placement.
Electronics Forum | Thu Aug 05 09:21:45 EDT 2010 | doug_johnson
I am havein a lot of trouble with KINGBRIGHT LEDs tombstoning in the reflow oven. It is a PLCC2 package. The stencil apatures are home plated. Can anyone help me
Electronics Forum | Mon Aug 22 06:33:43 EDT 2011 | janz
try to use stencil with "home plate" (arrow head) shapes of appertures for chips components. Any supplier of stencil can support you with this kind of design. janz
Electronics Forum | Wed Apr 29 08:24:55 EDT 2009 | davef
Commonly when we see solder balling, we think "too much paste." As a result, we pinch the apertures or change the shape to a "home plate." We don't think that's what's going on here. But what if this component has a thicker solder plating on its ter
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